In advanced semiconductor fabs, wet cleaning processes use
aggressive chemistries such as sulfuric acid, hydrogen peroxide (SPM), and
hydrofluoric acid (HF). These chemicals quickly degrade standard FKM seals,
leading to leaks, swelling, and unexpected downtime.
This case study shows how switching to FFKM O-rings improved seal life by 2.5x and helped a fab reduce downtime during critical
cleaning steps.
Challenge
-
Application: Wet bench tool handling SPM (sulfuric + peroxide mix) and HF.
-
Current
solution: FKM O-rings.
-
Problems
faced:
-
FKM
seals lasted only 2–3 weeks before swelling and cracking.
-
Leaks
disrupted batch cleaning, forcing tool shutdowns.
-
Frequent
interventions increased labor and chemical waste.
Solution
-
Fab
qualified FFKM O-rings designed for aggressive acid resistance.
-
Tested
in continuous wet cleaning cycles at 120–140 °C.
-
Head-to-head
comparison with standard FKM.
Results
-
Seal
lifetime increased by 2.5x (from ~3 weeks with FKM to 7–8 weeks with
FFKM).
-
Downtime
reduced by 40%, as fewer tool shutdowns were required.
-
Reduced
contamination risk: FFKM seals showed no visible swelling, cracking,
or particle shedding.
-
Improved
chemical compatibility allowed longer uninterrupted production cycles.
Table: Seal Performance in Wet Cleaning
|
Metric
|
FKM O-Rings
|
FFKM O-Rings
|
|
Lifetime in SPM (weeks)
|
~3
|
7–8
|
|
HF Compatibility
|
Poor
|
Excellent
|
|
Downtime (per quarter)
|
High
|
Reduced 40%
|
|
Contamination Risk
|
Significant
|
Low
|
Conclusion
In semiconductor wet cleaning, chemical compatibility is
critical. While FFKM O-rings cost more upfront, their ability to resist
harsh acids and maintain integrity at high temperatures delivers
measurable ROI through:
-
Fewer
tool interruptions
-
Improved
yield protection
-
Lower
long-term cost of ownership
Contact us for FFKM
O-ring compatibility charts and datasheets.