PRODUCT DESCRIPTION
FFKM FLS-8651W is one of the perfluoroelastomers, which is designed for the semiconductor of dry and wet etching process and has the same quality with Kalrez FFKM. It can be applied to most of chemicals (e.g. hydrochloric acid, nitric acid, hydrofluoric acid.), providing the excellent chemical resistance to acids, bases, and organic solvent. However, we recommend you to avoid amines.
FFKM FLS-8651W offer excellent physical properties and thermal stability (Oxygen free TGA test), please check the following comparison sheet with Kalrez 8475. Under the normal condition, the continuous service temperature can exceed 330°C.
FFKM FEATURE & BENEFITS
Upper continuous service temperature of 330 °C
Long time, stable and excellent sealing performance in high temperature environment
Outstanding perfluoroelastomer physical properties
Remarkable chemical, plasma and compression resistance
Ideal for thermal dry etch process
RECOMMENDED APPLICATIONS
Chamber, Lid seals
Fitting Seals
Gas Inlet, Outlet Seals
Valve Seals
RECOMMENDED PROCESS
Diffusion
Implant Anneal
RTP
Wet Etch
Wet Clean
Comparison Sheet with Kalrez
Comparison Sheet with Kalrez
|
Physical Properties
|
FFKM
FLS-8651W
|
Kalrez® 8475
|
Hardness, Shore A
|
63
|
74
|
|
Color
|
White
|
White
|
100% Modulus, psi
|
861
|
361
|
Tensile Strength at Break, Mpa
|
10.7
|
14.61
|
Elongation at Break, %
|
242.3
|
222
|
Compression Set, % (70hr at 200°C)
|
21.3
|
20
|
Maximum Service Temperature (°C)
|
315
|
300
|