PRODUCT DESCRIPTION
FFKM FLS-9650 is one of the perfluoroelastomers, which is designed for the semiconductor of dry and wet etching process and has the same quality with Kalrez FFKM product. It can be applied to most of chemicals (e.g. hydrochloric acid, nitric acid, hydrofluoric acid.), providing the excellent chemical resistance to acids, bases, and organic solvents.
FFKM FLS-9650 offers outstanding physical properties and thermal stability (Oxygen free TGA test), please check the following comparison sheet with Kalrez 9100. Under the normal operation, the maximum service temperature can exceed 315 ℃.
Moreover, for the aluminum bonding, FFKM FLS-9650 can be applied to Bonded Gate Seals and Slit Valve Seals well.
※ Widely used in the process of semiconductor and panel industry, like dry etching, HDPCVD, PECVD, PVD, Metal CVD, etc. ※
FFKM FEATURE & BENEFITS
Upper continuous service temperature of 315℃
Long time, stable and outstanding sealing performance in high temperature environment
Excellent physical properties
Perfect chemical and plasma resistance
Ideal for thermal dry etch process
RECOMMENDED APPLICATIONS
Chamber, Lid seals
Fitting Seals
Gas Inlet, Outlet Seals
Valve Seals
RECOMMENDED PROCESS
Diffusion
Implant Anneal
RTP
Wet Etch
Wet Clean
Comparison Sheet with Kalrez
Comparison Sheet with Kalrez
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Physical Properties
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FFKM
FLS-9650
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Kalrez® 9100
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Hardness, Shore A
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66
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70
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Color
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Amber
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Amber
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100% Modulus, psi
|
477
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750
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Tensile Strength at Break, Mpa
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12.9
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15.67
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Elongation at Break, %
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214.7
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238
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Compression Set, % (70hr at 200°C)
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12.5
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18
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Maximum Service Temperature (°C)
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315
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300
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